ISSN : 2288-9167(Print)
ISSN : 2288-923X(Online)
ISSN : 2288-923X(Online)
Journal of Odor and Indoor Environment Vol.13 No.2 pp.132-140
DOI : https://doi.org/10.15250/joie.2014.13.2.132
DOI : https://doi.org/10.15250/joie.2014.13.2.132
전산유체역학을 이용한 전자산업 클린룸내 포장공정에서의 환기시스템 개선
A ventilation evaluation for final packing process of microelectronics cleanrooms by using computational fluid dynamics
(Received 8 May, 2014; Revised 29 May, 2014; Accepted 20 June, 2014)
Abstract
The purpose of this study is to investigate information on performance of ventilation in high-tech microelectronicscleanrooms using computational fluid dynamics (CFD). One liquid crystal display (LCD) company was examinedfor evaluating the relationship between workplace concentration and ventilation rate efficiency by using CFDsoftware, Airpak 3.0v. Acetone concentration in cleanroom for final packing process, which is inspected LCD was40.1 ppm (GSD 1.91) (n = 55) as geometric mean, ranged 7.8~128.7 ppm and weakly correlated with ventilationrate efficiency (R2 = 0.37, p < 0.01). Resulting from computational fluid dynamics (CFD), acetone concentrationcan be reduced 62% when install booth type local exhaust system, the most efficient way among 10 other differentventilation methods like increasing volume of general ventilation, changing the location of workers, supply orexhaust diffusers and install downstream type local exhaust system, etc. We found that volitile organic compoundsin cleanroom can be a matter of adverse health effects and the concentration was correlated with ventilation rateefficiency. The most optimized plan to control the contaminants in solvent cleaning work in cleanroom was boothtype local exhaust system
